Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips

摘要

An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.

主权项

1. An electronic system comprising:
an electronic body having a surface with conductive terminal pads; at least one capacitor embedded in the body, the capacitor comprising:
an insulating first polymeric film covering the body surface except the conductive terminal pads, the first polymeric film being adhesive;a sheet of capacitive elements with a first and a second capacitor terminal, the first terminal being a metal foil attached to the first polymeric film and the second terminal being a conductive polymeric compound;the sheet having sets of via holes, including a first set holes reaching the metal foil, a second set holes reaching the conductive terminals pads, and a third set holes reaching the conductive polymeric compound;an insulating second polymeric film lining the sidewalls of the sets of via holes; andmetal in the sets of via holes between the polymeric sidewalls, defining conductive traces and attachment pads on a surface of the system.