发明名称 Method to fabricate FinFET sensors, in particular, FinFET sensors for ionic, chemical and biological applications on Si-Bulk
摘要 The present invention relates to a method of producing a FinFET sensor device comprising the steps of: providing a silicon substrate;etching the silicon substrate to produce at least one upwardly extending Fin structure externally protruding from a surface of the silicon substrate;depositing a spacer layer on the at least one Fin structure;anisotropically etching a section of the spacer layer to expose the underlying silicon;isotropic etching of the exposed silicon surrounding the at least one Fin structure; andcarrying out oxidation of the silicon surrounding the at least one Fin structure to produce a Fin structure of silicon inside the at least one Fin structure.;The present invention also relates to FinFET sensor devices produced by the above method.
申请公布号 US9570288(B2) 申请公布日期 2017.02.14
申请号 US201414219261 申请日期 2014.03.19
申请人 ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL) 发明人 Rigante Sara;Ionescu Adrian Mihai
分类号 H01L21/02;H01L29/66;H01L29/78;H01L21/308;H01L21/311;G01N27/414 主分类号 H01L21/02
代理机构 Sheridan Ross P.C. 代理人 Sheridan Ross P.C.
主权项 1. A method of producing a FinFET sensor device comprising the steps of: providing a silicon substrate; etching the silicon substrate to produce at least one upwardly extending Fin structure externally protruding from a surface of the silicon substrate; depositing a spacer layer on the at least one Fin structure; etching a section of the spacer layer to expose the underlying silicon; isotropic etching of the exposed silicon surrounding the at least one Fin structure; and carrying out oxidation of the silicon surrounding the at least one upwardly extending Fin structure to produce a Fin structure of silicon that is detached and isolated from the silicon substrate and inside the at least one upwardly extending Fin structure.
地址 CH