发明名称 Sensor mounting methodology
摘要 Methods and devices for mounting a sensor are presented herein. A temperature sensor assembly for a capacitor bank is disclosed that includes two opposing substrates, and a plurality of contact temperature sensors attached to each substrate. Each temperature sensor is configured to directly contact a surface of one of the capacitor cans in the capacitor bank and therefrom generate a signal indicative of the temperature of the capacitor can. A biasing member attaches the two substrates together. The biasing member is configured to selectively contract, such that the width of the sensor assembly is less than the gap distance between adjacent sets of tandem capacitor cans and the sensor assembly can insert between the sets of capacitor cans, and expand, such that the width of the sensor assembly is greater than the gap distance and the sensor assembly is tensioned against and thereby secured between the sets of capacitor cans.
申请公布号 US9568374(B2) 申请公布日期 2017.02.14
申请号 US201414257387 申请日期 2014.04.21
申请人 SCHNEIDER ELECTRIC USA, INC. 发明人 Farago Jeffrey J.;Perez Marcelo A.;Harding Stewart John
分类号 G01K1/14;G01K1/16;G01K1/02;G01K13/00 主分类号 G01K1/14
代理机构 Lando & Anastasi, LLP 代理人 Lando & Anastasi, LLP
主权项 1. A temperature sensor assembly for a capacitor bank with a first set of tandem capacitor cans generally parallel to and spaced a gap distance from a second set of tandem capacitor cans, the temperature sensor assembly comprising: first and second opposing substrates; first and second pluralities of contact temperature sensors, each of the pluralities of contact temperature sensors being mounted to a respective one of the first and second substrates, wherein each of the contact temperature sensors is configured to directly contact a surface of a respective one of the capacitor cans and therefrom generate a first signal indicative of a temperature of the respective capacitor can; and a first biasing member attaching the first and second substrates together, wherein the first biasing member is configured to selectively contract to a first thickness such that a width of the sensor assembly is less than the gap distance and the sensor assembly can insert between the first and second sets of tandem capacitor cans, and selectively expand to a second thickness such that the width of the sensor assembly is substantially the gap distance wherein the sensor assembly, once inserted, is tensioned against and thereby secured between the first and second sets of tandem capacitor cans.
地址 Andover MA US
您可能感兴趣的专利