Electronic device provided with an encapsulation structure with improved electric accessibility and method of manufacturing the electronic device

摘要

An electronic device comprising: a semiconductor die integrating an electronic component; a leadframe housing the semiconductor die; a protection body, which surrounds laterally and at the top the semiconductor die and, at least in part, the leadframe structure, defining a top surface, a bottom surface, and a thickness of the electronic device; and a conductive lead electrically coupled to the semiconductor die. The conductive lead is modelled in such a way as to extend throughout the thickness of the protection body for forming a front electrical contact accessible from the top surface of the electronic device, and a rear electrical contact accessible from the bottom surface of the electronic device.

主权项

1. An electronic device comprising:
a semiconductor die integrating an electronic component and having a front side and a rear side that is opposite to the front side, the front side having a first access region that provides electric access to the electronic component, the rear side having a second access region that provides electric access to the electronic component; a leadframe structure including a supporting region that supports the semiconductor die, the rear side of the semiconductor die coupled to the supporting region; a protection body that laterally surrounds the semiconductor die and is over the first region of the semiconductor die and at least a portion of the leadframe structure, the protection body having atop surface, a bottom surface, a first lateral surface, a second lateral surface, and a thickness extending between the top surface and the bottom surface; a first conductive lead electrically coupled to the first access region, wherein said first conductive lead extends through the thickness of said protection body and forms a first front electrical contact exposed at the top surface, a first rear electrical contact exposed at the bottom surface, and a first lateral electrical contact exposed along the entire thickness at the first lateral surface; and a second conductive lead insulated from the first conductive lead and electrically coupled to the second access region, wherein said second conductive lead extends along the thickness of said protection body and forms a second front electrical contact exposed at the top surface, a second rear electrical contact exposed at the bottom surface, and a second lateral electrical contact exposed along the entire thickness of the second lateral surface.