| 发明名称 |
Polishing slurry and substrate polishing method using the same |
| 摘要 |
A polishing slurry for tungsten and a substrate polishing method are disclosed. The polishing slurry includes an abrasive for performing polishing and having positive zeta potential, and a potential modulator for promoting the oxidation of the tungsten and for controlling the zeta potential of the abrasive. |
| 申请公布号 |
US9567490(B2) |
申请公布日期 |
2017.02.14 |
| 申请号 |
US201414519122 |
申请日期 |
2014.10.20 |
| 申请人 |
UBMATERIALS INC. |
发明人 |
Jung Seung Won |
| 分类号 |
C09K13/00;C09K13/02;H01L21/302;H01L21/461;B44C1/22;C03C15/00;C03C25/68;C09G1/02;H01L21/321;C09K3/14;H01L21/304;C23F3/06 |
主分类号 |
C09K13/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polishing slurry for tungsten, comprising:
an abrasive for performing polishing; and a potential modulator for controlling the zeta potential of the abrasive, wherein the potential modulator comprises potassium ferrioxalate, and wherein the zeta potential of the abrasive is +5 mV to −5 mV, and the polishing selectivity of the tungsten and an insulating layer is 1:1 to 1:8, or 1:1 to 2:1, or 6:1 or more. |
| 地址 |
KR |
