| 发明名称 | Chip packaging method and chip package using hydrophobic surface | ||
| 摘要 | A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other. | ||
| 申请公布号 | US9570415(B2) | 申请公布日期 | 2017.02.14 |
| 申请号 | US201514696171 | 申请日期 | 2015.04.24 |
| 申请人 | Korea Advanced Institute of Science and Technology | 发明人 | Park Hyo Hoon;Seo Suk Min;Kim Jong Hun;Han Sun Kyu |
| 分类号 | H01L23/00;H01L25/00;H01L25/065 | 主分类号 | H01L23/00 |
| 代理机构 | Kolisch Hartwell, P.C. | 代理人 | Kolisch Hartwell, P.C. |
| 主权项 | 1. A chip package comprising: one of a first chip or a first board that includes a superhydrophobic surface having a predetermined size and a hydrophilic surface disposed on a predetermined position of the superhydrophobic surface; and one of a second chip or a second board that includes a superhydrophobic surface having a predetermined size and a hydrophilic surface disposed on a predetermined position of the superhydrophobic surface, wherein the one of the first chip or the first board and the one of the second chip or the second board are packaged by a liquid metal ball generated on the hydrophilic surface disposed on the one of the first chip or the first board and a liquid metal ball generated on the hydrophilic surface disposed on the one of the second chip or the second board. | ||
| 地址 | KR | ||