Tiled hybrid array and method of forming

摘要

A tiled array of hybrid assemblies and a method of forming such an array enables the assemblies to be placed close together. Each assembly comprises first and second dies, with the second die mounted on and interconnected with the first die. Each vertical edge of a second die which is to be located adjacent to a vertical edge of another second die in the tiled array is etched such that the etched edge is aligned with a vertical edge of the first die. Indium bumps are deposited on a baseplate where the hybrid assemblies are to be mounted, and the assemblies are mounted onto respective indium bumps using a hybridizing machine, enabling the assemblies to be placed close together, preferably ≦10 μm. The first and second dies may be, for example. a detector and a readout IC, or an array of LEDs and a read-in IC.

主权项

1. A method of forming a tiled array of hybrid assemblies on a baseplate, comprising:
forming a plurality of hybrid assemblies, each of which comprises:
a first die; anda second die mounted on and interconnected with said first die; etching each vertical edge of said second dies which is to be located adjacent to a vertical edge of another second die in said tiled array such that said etched vertical edge is aligned with a vertical edge of said first die; providing a baseplate on which said tiled array is to be mounted; depositing a plurality of indium bumps on said baseplate where said hybrid assemblies are to be mounted; and pressing said hybrid assemblies onto said indium bumps using a hybridizing machine.