| 发明名称 | Electronic component module, board, and method of manufacturing electronic component module | ||
| 摘要 | An electronic component module includes a board having an electronic component mounted on a surface of the board and a shield case mounted on the surface of the board and covering the electronic component. The board includes a projecting part projecting from the surface of the board. The projecting part is formed of plating at a position along a sidewall of the shield case and is soldered to the shield case. | ||
| 申请公布号 | US9572264(B2) | 申请公布日期 | 2017.02.14 |
| 申请号 | US201414310007 | 申请日期 | 2014.06.20 |
| 申请人 | FUJITSU COMPONENT LIMITED | 发明人 | Yamamoto Shinya;Muramatsu Tohru;Muranaga Masakazu |
| 分类号 | H05K9/00;H05K3/30;H05K3/40;H05K1/02;H05K3/34 | 主分类号 | H05K9/00 |
| 代理机构 | IPUSA, PLLC | 代理人 | IPUSA, PLLC |
| 主权项 | 1. An electronic component module, comprising: a printed board having an electronic component mounted on a surface thereof, the printed board including a plating layer formed on the surface of the printed board to project therefrom; and a shield case mounted on the surface of the printed board and covering the electronic component, wherein the plating layer is at a position along a sidewall of the shield case and is soldered to the shield case. | ||
| 地址 | Tokyo JP | ||