| 发明名称 | Method for wafer grinding | ||
| 摘要 | A method of grinding a wafer includes positioning a wafer beneath a grinding wheel and aligning the wafer and the grinding wheel. The method further includes contacting a grinding surface of an outer base of the grinding wheel with the wafer while rotating at least one of the wafer and the grinding wheel, contacting a grinding surface of an inner frame of the grinding wheel with the wafer while rotating at least one of the wafer and the grinding wheel, without changing the alignment between the wafer and the grinding wheel, and tilting one of the wafer and the grinding wheel relative to the other during at least one of the first and the second contacting steps. The method also includes removing the wafer from the position beneath the grinding wheel. | ||
| 申请公布号 | US9566683(B2) | 申请公布日期 | 2017.02.14 |
| 申请号 | US201514841477 | 申请日期 | 2015.08.31 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Wei Kuo-Hsiu;Chen Kei-Wei;Wang Ying-Lang;Kuo Chun-Ting |
| 分类号 | B24B7/22;B24D7/14 | 主分类号 | B24B7/22 |
| 代理机构 | Slater Matsil, LLP | 代理人 | Slater Matsil, LLP |
| 主权项 | 1. A method of grinding a wafer, the method comprising: positioning a wafer beneath a grinding wheel and aligning the wafer and the grinding wheel; contacting a grinding surface of an outer base of the grinding wheel with the wafer while rotating at least one of the wafer and the grinding wheel; contacting a grinding surface of an inner frame of the grinding wheel with the wafer while rotating at least one of the wafer and the grinding wheel, without changing the alignment between the wafer and the grinding wheel; tilting one of the wafer and the grinding wheel relative to the other during at least one of the first and the second contacting steps; and removing the wafer from the position beneath the grinding wheel. | ||
| 地址 | Hsin-Chu TW | ||