DESIGN OF DISK/PAD CLEAN WITH WAFER AND WAFER EDGE/BEVEL CLEAN MODULE FOR CHEMICAL MECHANICAL POLISHING

摘要

A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and space apart relation, the first pad holder rotatable on a second axis rotatable parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance defined between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, wherein the second pad holder is couple with a rotary arm.

主权项

1. A method for cleaning a substrate, comprising:
spinning a substrate disposed in a substantially vertical orientation; providing a cleaning fluid to a surface of the spinning substrate; pressing a first pad against the surface of the spinning substrate; moving the first pad across the surface of the substrate along a curved path; providing a polishing fluid to an exclusion region, edge portion, or both the exclusion region and edge portion of the spinning substrate; pressing a second pad against the exclusion region, edge portion, or both the exclusion region and the edge portion of the spinning substrate; and moving the second pad laterally across the exclusion region, edge portion, or both the exclusion region and edge portion of the substrate.