| 发明名称 |
Removal of Particles on Back Side of Wafer |
| 摘要 |
The present disclosure provides a method of cleaning a semiconductor wafer during a process of fabricating a semiconductor device. The method includes loading a semiconductor wafer into a wafer handling system. The method includes removing contaminant particles from an edge region of the wafer from the back side, wherein alignment marks are located in the edge region. The method includes collecting the removed contaminant particles and discarding the collected contaminant particles out of the wafer handling system. The disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer cleaning device that is operable to clean a predetermined region of the wafer on the back surface thereof. The predetermined region of the wafer at least partially overlaps with one or more alignment marks. |
| 申请公布号 |
US2017040155(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201615295731 |
申请日期 |
2016.10.17 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Lin Hsun-Peng;Chang Hsin-Kuo;Chung Han-Chih;Wang Yueh-Chih;Hsieh Chi-Jen |
| 分类号 |
H01L21/02;B08B15/04;B08B1/00;H01L23/544;H01L21/67 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating a semiconductor device, comprising:
loading a semiconductor wafer into a wafer handling system, the semiconductor wafer having a front side and a back side and one or more alignment marks; removing contaminant particles from an edge region of the wafer from the back side, wherein the one or more alignment marks are located in the edge region; and collecting the removed contaminant particles and discarding the collected contaminant particles out of the wafer handling system. |
| 地址 |
Hsin-Chu TW |
