| 发明名称 |
WAVELENGTH CONVERSION BONDING MEMBER, WAVELENGTH CONVERSION HEAT DISSIPATION MEMBER, AND LIGHT-EMITTING DEVICE |
| 摘要 |
A wavelength conversion bonding member includes a phosphor ceramic element and a bonding layer provided on one side of the phosphor ceramic element, wherein the bonding layer has a thermal conductivity of more than 0.20 W/m·K, and the bonding layer has a reflectivity of 90% or more. |
| 申请公布号 |
US2017040502(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201515303933 |
申请日期 |
2015.04.02 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
FUJII Hironaka;SHIRAKAWA Masahiro |
| 分类号 |
H01L33/50;C09K5/14;C04B35/505;C09D11/00;H01L33/60;C09D7/12;C09D183/04;C08K3/08;C08K3/22;H01L33/64;C09K11/77;C09D1/02 |
主分类号 |
H01L33/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wavelength conversion bonding member including a phosphor ceramic element and a bonding layer provided on one side of the phosphor ceramic element,
wherein the bonding layer has a thermal conductivity of more than 0.20 W/m·K, and the bonding layer has a reflectivity of 90% or more. |
| 地址 |
Ibaraki-shi, Osaka JP |
