METHOD OF FABRICATING SEMICONDUCTOR DEVICE

摘要

A semiconductor device may be manufactured based on patterning groups to include a metal layer patterned according to separate patterning groups. The patterning groups may be based on a layout pattern. Preparing the layout pattern may include selecting first and second power patterns, selecting first and second patterns therebetween, and selecting a tie-connection pattern to connect the first power pattern to the first pattern. The manufacturing may include forming metal lines according to the patterning groups. Photomasks may be manufactured according to the layout pattern, and the metal lines may be formed according to the photomasks. A first photomask may be manufactured based on the first and second power patterns, the first pattern, and the tie-connection pattern, and a second photomask may be manufactured based on the second pattern.

主权项

1. A method of manufacturing a semiconductor device, comprising:
preparing a layout pattern, the preparing including,
selecting first and second power patterns,selecting first and second patterns between the first and second power patterns; andselecting a tie-connection pattern connecting the first power pattern to the first pattern; manufacturing a first photomask based on the first and second power patterns, the first pattern, and the tie-connection pattern; manufacturing a second photomask based on the second pattern; and forming one or more metal lines on a substrate according to the first and second photomasks.