| 发明名称 |
LEAD-FREE EUTECTIC SOLDER ALLOY COMPRISING ZINC AS THE MAIN COMPONENT AND ALUMINUM AS AN ALLOYING METAL |
| 摘要 |
A lead-free solder alloy contains zinc (Zn) as the main component and aluminum (Al) as an alloying metal. The solder alloy is a eutectic having a single melting point in the range of 320 to 390° C. (measured by DSC at a heating rate of 5° C. min-1). |
| 申请公布号 |
US2017036307(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201515304162 |
申请日期 |
2015.04.15 |
| 申请人 |
Heraeus Materials Singapore, PTE., Ltd. |
发明人 |
PAN Wei Chih;BAQUIRAN Joseph Aaron Mesa;REYNOSO Inciong |
| 分类号 |
B23K35/28;H01L23/498;H01L23/495;C22C18/04;C22C18/00 |
主分类号 |
B23K35/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
Singapore SG |
