| 发明名称 |
PROCESS FOR PRODUCING SUBSTRATE HAVING WIRING, RADIATION-SENSITIVE COMPOSITION, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE |
| 摘要 |
A process for producing a substrate having wiring includes steps (i) to (v) described as follows: (i) applying a radiation-sensitive composition on a substrate to form a coating film; (ii) irradiating a prescribed part of the coating film with radiation to allow the coating film to have a radiation-irradiated region and a radiation-unirradiated region; (iii) allowing the coating film obtained in the step (ii) to have a concave region and a convex region; (iv) forming wiring on the concave region; and (v) removing the convex region by an application of radiation or by heating. |
| 申请公布号 |
US2017042038(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201615262404 |
申请日期 |
2016.09.12 |
| 申请人 |
JSR CORPORATION |
发明人 |
HAMAGUCHI HITOSHI;TANAKA KENROU;OOKITA KENZOU;KURIYAMA KEISUKE |
| 分类号 |
H05K3/10;G03F7/027;G03F7/36;H05K3/12;G03F7/20 |
主分类号 |
H05K3/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A process producing a substrate having wiring comprising steps (i) to (v) described below:
(i) applying a radiation-sensitive composition on a substrate to form a coating film, (ii) irradiating a prescribed part of the coating film with radiation to allow the coating film to have a radiation-irradiated region and a radiation-unirradiated region, (iii) allowing the coating film obtained in the step (ii) to have a concave region and a convex region, (iv) forming wiring on the concave region, and (v) removing the convex region by an application of radiation or by heating. |
| 地址 |
TOKYO JP |
