发明名称 SUBMICRON WAFER ALIGNMENT
摘要 Certain aspects relate to systems and techniques for submicron alignment in wafer optics. One disclosed method of alignment between wafers to produce an integrated lens stack employs a beam splitter (that is, a 50% transparent mirror) that reflects the alignment mark of the top wafer when the microscope objective is focused on the alignment mark of the bottom wafer. Another disclosed method of alignment between wafers to produce an integrated lens stack implements complementary patterns that can produce a Moiré effect when misaligned in order to aid in visually determining proper alignment between the wafers. In some embodiments, the methods can be combined to increase precision.
申请公布号 US2017038552(A1) 申请公布日期 2017.02.09
申请号 US201615188635 申请日期 2016.06.21
申请人 QUALCOMM Incorporated 发明人 Georgiev Todor Georgiev
分类号 G02B7/00;G02B21/00;G06T7/00;G02B21/36;G02B27/10;H04N5/225;G02B13/00;G02B27/60 主分类号 G02B7/00
代理机构 代理人
主权项 1. An optical wafer stack comprising: a first transparent wafer including at least a first lens; a second transparent wafer including at least a second lens; a first spacer wafer positioned between the first transparent wafer and the second transparent wafer and including at least a first cell comprising a first perimeter around a first opening, the first lens and the second lens protruding at least partially into the first opening; a first alignment mark provided on the first transparent wafer; a second alignment mark provided on the second transparent wafer; and a first beam splitter layer disposed on a surface of the first spacer layer at a midpoint between an optical path between the first alignment mark and the second alignment mark.
地址 San Diego CA US
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