| 发明名称 |
SEMICONDUCTOR DEVICES |
| 摘要 |
A semiconductor device includes a pad disposed on a semiconductor layer, an insulating layer disposed between the semiconductor layer and the pad, a through-via penetrating the semiconductor layer and the insulating layer so as to be connected to the pad, and an isolation layer penetrating the semiconductor layer and surrounding the pad when viewed from a plan view. |
| 申请公布号 |
US2017040358(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201615224095 |
申请日期 |
2016.07.29 |
| 申请人 |
Samsung Electronics Co. , Ltd. |
发明人 |
KIM Sun-Hyun;Byeon Kyeongjae;Song Chungho;Jeong Heegeun |
| 分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a pad on a semiconductor layer; an insulating layer that is between the semiconductor layer and the pad; a through-via that penetrates the semiconductor layer and the insulating layer and that is connected to the pad; and an isolation layer that penetrates the semiconductor layer and that surrounds the pad when viewed from a plan view. |
| 地址 |
Suwon-si KR |
