| 摘要 |
The present invention relates to an epoxy resin composition for a copper clad laminate, and an application of the epoxy resin composition. The epoxy resin composition contains phosphorus-containing and bromine-containing flame retardant additives, and may be used for the preparation of pre-pregs and copper clad laminates. By using brominated polystyrene, decabromodiphenyl ethane etc. as bromine sources and taking a phosphazene, melamine polyphosphate, aluminium metaphosphate or melamine cyanurate etc. as phosphorus sources, and adjusting the proportions of the phosphorus-containing and bromine-containing flame retardant additives within the composition, the bromine content is controlled at 5-12%, the phosphorus content is controlled at 0.2-1.5%, and the flame retardancy achieves the level of UL94 V-0. Compared to pure bromine flame retardant copper clad laminates, the heat resistance is higher, and a higher CTI value is achieved. Compared to pure phosphorus flame retardant copper clad laminates, the moisture absorption is lower, and the adhesion performance and process operability required for printed circuit substrates are provided. Compared to the use of a large amount of aluminium hydroxide in traditional high CTI sheet material, the present invention achieves CTI > 600V using a small amount of aluminium hydroxide or without using aluminium hydroxide. |
