| 摘要 |
An LED pixel point, comprising a drive IC (20) and an LED chip (40). The LED chip (40) is stacked and mounted on the surface of the drive IC (20), a wire (31) led out from a negative electrode of the LED chip (40) is connected to the drive IC (20), and the drive IC (20) is an unencapsulated bare die. The surface of the bare die is provided with an insulation layer, a bonding pad (30) connected to a positive electrode is provided above the insulation layer, the LED chip (40) is mounted on the bonding pad (30), and the positive electrode of the LED chip (40) is electrically connected to the bonding pad (30). The light transmittance of an LED display product is improved. |
