Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device

摘要

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2-D1 is 0.30 to 3.83 μm, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of the layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf/cm2 at 220° C. for 2 hours.

主权项

1. A carrier-attached copper foil comprising a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2-D1 is 0.30 to 3.83 μm, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of the layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf/cm2 at 220° C. for 2 hours.