发明名称 WIRED CIRCUIT BOARD
摘要 A wired circuit board includes a metal pedestal portion formed from a metal material that is the same as the material of the metal supporting board at the pad portion, a pedestal opening formed by opening the metal pedestal portion, a lower conductive layer disposed on one side in the thickness direction of the metal pedestal portion as the first conductive layer, and an upper conductive layer as the second conductive layer formed on one side in the thickness direction of the lower conductive layer as the first conductive layer, wherein one of the lower conductive layer as the first conductive layer and the upper conductive layer as the second conductive layer is disposed in the pedestal opening when projected in the thickness direction, and the periphery of the other is disposed outside of the pedestal opening when projected in the thickness direction.
申请公布号 US2017042024(A1) 申请公布日期 2017.02.09
申请号 US201515305188 申请日期 2015.03.20
申请人 NITTO DENKO CORPORATION 发明人 SUGIMOTO Yuu
分类号 H05K1/05;G11B5/48 主分类号 H05K1/05
代理机构 代理人
主权项 1. A wired circuit board comprising: a metal supporting board having an opening, a first conductive layer disposed on one side in a thickness direction of the metal supporting hoard, and a second conductive layer disposed on one side in the thickness direction of the first conductive layer, wherein one of the first conductive layer and the second conductive layer is disposed in the opening when projected in the thickness direction, and the periphery of the other of the first conductive layer and the second conductive layer is disposed outside of the opening when projected in the thickness direction.
地址 Osaka JP