发明名称 |
FERROELECTRIC MEMORY DEVICE AND FABRICATION METHOD THEREOF |
摘要 |
The disclosed technology generally relates to semiconductor devices, and more particularly to a non-volatile ferroelectric memory device and to methods of fabricating the same. In one aspect, a non-volatile memory device includes a high dielectric constant layer (high-k) layer or a metal layer on a semiconductor substrate. The non-volatile memory device additionally includes a two-dimensional (2D) semiconductor channel layer interposed between the high-k layer or metal layer and a ferroelectric layer. The non-volatile memory device additionally includes a metal gate layer on the ferroelectric layer, and further includes a source region and a drain region each electrically coupled to the 2D semiconductor channel layer. |
申请公布号 |
US2017040331(A1) |
申请公布日期 |
2017.02.09 |
申请号 |
US201615230289 |
申请日期 |
2016.08.05 |
申请人 |
IMEC VZW |
发明人 |
Van Houdt Jan;Thean Voon Yew |
分类号 |
H01L27/115;H01L29/66;H01L29/51;H01L29/78 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
1. A non-volatile memory device comprising:
a high dielectric constant (high-k) layer or a metal layer on a semiconductor substrate; a two-dimensional (2D) semiconductor channel layer interposed between the high-k layer or the metal layer and a ferroelectric layer; a metal gate layer on the ferroelectric layer; and a source region and a drain region each electrically coupled to the 2D semiconductor channel layer. |
地址 |
Leuven BE |