发明名称 FERROELECTRIC MEMORY DEVICE AND FABRICATION METHOD THEREOF
摘要 The disclosed technology generally relates to semiconductor devices, and more particularly to a non-volatile ferroelectric memory device and to methods of fabricating the same. In one aspect, a non-volatile memory device includes a high dielectric constant layer (high-k) layer or a metal layer on a semiconductor substrate. The non-volatile memory device additionally includes a two-dimensional (2D) semiconductor channel layer interposed between the high-k layer or metal layer and a ferroelectric layer. The non-volatile memory device additionally includes a metal gate layer on the ferroelectric layer, and further includes a source region and a drain region each electrically coupled to the 2D semiconductor channel layer.
申请公布号 US2017040331(A1) 申请公布日期 2017.02.09
申请号 US201615230289 申请日期 2016.08.05
申请人 IMEC VZW 发明人 Van Houdt Jan;Thean Voon Yew
分类号 H01L27/115;H01L29/66;H01L29/51;H01L29/78 主分类号 H01L27/115
代理机构 代理人
主权项 1. A non-volatile memory device comprising: a high dielectric constant (high-k) layer or a metal layer on a semiconductor substrate; a two-dimensional (2D) semiconductor channel layer interposed between the high-k layer or the metal layer and a ferroelectric layer; a metal gate layer on the ferroelectric layer; and a source region and a drain region each electrically coupled to the 2D semiconductor channel layer.
地址 Leuven BE