| 发明名称 |
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
In one embodiment, a semiconductor manufacturing apparatus includes a wafer retaining module configured to retain a wafer by a chuck pin and to rotate the wafer. The apparatus further includes a wafer cleaning module configured to retain a cleaning member for cleaning a surface of the wafer and to rotate the cleaning member around a first rotation axis that is perpendicular to the surface of the wafer, the wafer cleaning module cleaning the surface of the wafer by moving the cleaning member on the surface of the wafer while the cleaning member contacts the wafer and rotates. The wafer cleaning module retains and rotates the cleaning member so that the first rotation axis does not pass through a contact region of the cleaning member with respect to the wafer. |
| 申请公布号 |
US2017040189(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201615012946 |
申请日期 |
2016.02.02 |
| 申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
WATANABE Takashi;NAKAYAMA Takayuki;TAKAYASU Jun |
| 分类号 |
H01L21/67;B08B3/04;B08B1/00;B08B1/04;H01L21/687;H01L21/02 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor manufacturing apparatus comprising:
a wafer retaining module configured to retain a wafer by a chuck pin and to rotate the wafer; and a wafer cleaning module configured to retain a cleaning member for cleaning a surface of the wafer and to rotate the cleaning member around a first rotation axis that is perpendicular to the surface of the wafer, the wafer cleaning module cleaning the surface of the wafer by moving the cleaning member on the surface of the wafer while the cleaning member contacts the wafer and rotates; wherein the wafer cleaning module retains and rotates the cleaning member so that the first rotation axis does not pass through a contact region of the cleaning member with respect to the wafer. |
| 地址 |
Minato-ku JP |
