| 发明名称 |
MOUNTING STRUCTURE AND METHOD FOR PRODUCING MOUNTING STRUCTURE |
| 摘要 |
A mounting structure, including: a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface. |
| 申请公布号 |
US2017040184(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201615212158 |
申请日期 |
2016.07.15 |
| 申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
HINO HIROHISA;SUZUKI YASUHIRO;MORI MASATO;OHASHI NAOMICHI |
| 分类号 |
H01L21/48;H01L25/065;H01L23/498 |
主分类号 |
H01L21/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A mounting structure, comprising:
a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface. |
| 地址 |
Osaka JP |
