| 摘要 |
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when a semiconductor power element is bonded to a metal lead frame, and which is free from lead, thereby placing little burden on the environment. Namely, a conductive composition that contains, as essential components, at least a sulfide compound represented by R-S-R' (wherein R is an organic group containing at least carbon; R' is an organic group that is the same as or different from the R moiety; and the R and R' moieties may combine with each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni. A conductive paste and a conductive bonding film, each of which is produced using this conductive composition; and a dicing die bonding film which is obtained by bonding the conductive bonding film and an adhesive tape. |
