| 发明名称 |
HIGH ISOLATION GROUNDING DEVICE |
| 摘要 |
The device includes a body and a plurality of contact portions. The body is substantially planar. The plurality of contact portions are associated with the body so as to form ports. The plurality of contact portions are in electrical communication with the body. The port of each contact portion having an inside diameter substantially equal to ID1. The body and the contact portions are constructed of a conductive metallic material. |
| 申请公布号 |
US2017042070(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201615299975 |
申请日期 |
2016.10.21 |
| 申请人 |
Cinch Connectivity Solutions, Inc. |
发明人 |
Baumler Robert Joseph;Dvorak Mark Daniel;Kerekes James Richard |
| 分类号 |
H05K9/00;H05K1/18;H01R13/6598;H01R24/50;H01R13/03;H01R13/6594 |
主分类号 |
H05K9/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device comprising:
a gasket including:
a body which is conductive, linear, and planar, anda row of ports extending on the body longitudinally, wherein at least one of the ports includes a contact portion extending in a closed shape, wherein the contact portion is conductive and in electrical communication with the body. |
| 地址 |
Bannockburn IL US |
