| 摘要 |
Systems, methods, and computer programs, embodied in or as a memory management module, are disclosed for thermally controlling memory to increase its performance. One exemplary embodiment includes a memory, one or more processors, and a thermoelectric cooling device. The one or more processors access the memory via a memory controller electrically coupled to the memory. The thermoelectric cooling device is configured to thermally control the memory in response to a predicted change in temperature of the memory. |
