发明名称 MULTI-CHIP MODULE
摘要 One example of a multi-chip module includes a substrate, a semiconductor chip, and an optical transceiver. The substrate has a first side and a second side opposite the first side. The semiconductor chip is electrically coupled to the first side of the substrate. The optical transceiver is electrically coupled to the second side of the substrate.
申请公布号 WO2017023257(A1) 申请公布日期 2017.02.09
申请号 WO2015US43189 申请日期 2015.07.31
申请人 HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP 发明人 LEIGH, Kevin;MEGASON, George;NORTON, John
分类号 H01L25/065;H01L25/16;H01L25/18 主分类号 H01L25/065
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