发明名称 |
MULTI-CHIP MODULE |
摘要 |
One example of a multi-chip module includes a substrate, a semiconductor chip, and an optical transceiver. The substrate has a first side and a second side opposite the first side. The semiconductor chip is electrically coupled to the first side of the substrate. The optical transceiver is electrically coupled to the second side of the substrate. |
申请公布号 |
WO2017023257(A1) |
申请公布日期 |
2017.02.09 |
申请号 |
WO2015US43189 |
申请日期 |
2015.07.31 |
申请人 |
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
发明人 |
LEIGH, Kevin;MEGASON, George;NORTON, John |
分类号 |
H01L25/065;H01L25/16;H01L25/18 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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