HEAT DISSIPATING STRUCTURE AND ELECTRONIC APPARATUS

摘要

Provided is a heat dissipating structure capable of reducing electromagnetic waves to be radiated from a heat generating component. This heat dissipating structure is provided with: a heat spreader that is provided in a heat generating component mounted on a substrate; a heat dissipating plate that is disposed at a position facing the heat spreader; a heat transfer member, which is disposed between the heat spreader and the heat dissipating plate, and transfers heat from the heat spreader to the heat dissipating plate; and a conductive member that electrically connects the heat spreader and the heat dissipating plate to each other.