发明名称 |
CYCLIC OLEFIN POLYMER COMPOSITIONS AND POLYSILOXANE RELEASE LAYERS FOR USE IN TEMPORARY WAFER BONDING PROCESSES |
摘要 |
The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing. |
申请公布号 |
US2017040200(A1) |
申请公布日期 |
2017.02.09 |
申请号 |
US201615332581 |
申请日期 |
2016.10.24 |
申请人 |
Brewer Science Inc. |
发明人 |
Bai Dongshun;Xu Gu;Blumenshine Debbie;Huang Baron;Wong Andy |
分类号 |
H01L21/683;C08G77/14;C08G77/20;C09J7/02;C08G77/26;C09J5/04;C09J145/00;C09J183/06;H01L21/50;C08G77/18 |
主分类号 |
H01L21/683 |
代理机构 |
|
代理人 |
|
主权项 |
1. A temporary bonding method comprising:
(i) providing a free-standing film comprising a cyclic olefin polymer; (ii) forming a stack at a temperature of at least 100° C., said stack comprising:
a first substrate having a back surface and a front surface;a bonding layer adjacent said front surface, said bonding layer being formed from said free-standing film; anda second substrate having a first surface; and (iii) separating said first and second substrates. |
地址 |
Rolla MO US |