This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5 - 25 percent by weight an alkaline compound; (b) 1 - 25 percent by weight an alcohol amine compound; (c) 0.1 - 20 percent by weight a hydroxylammonium compound; (d) 5 - 95 percent by weight an organic solvent; (e) 0.1 - 5 percent by weight a corrosion inhibitor compound; and (f) 2 -25 percent by weight water.
申请公布号
WO2017023677(A1)
申请公布日期
2017.02.09
申请号
WO2016US44423
申请日期
2016.07.28
申请人
FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
发明人
SAKAMURI, Raj;DIMOV, Ognian N.;NAIINI, Ahmad A.;MALIK, Sanjay;DE, Binod B.;REINERTH, William A.