发明名称 OPTICAL MODULES
摘要 Optical modules are disclosed. An example method includes coupling optoelectronic components to a carrier substrate; overmolding the optoelectronic components with a material to form a molded panel, a surface of the molded panel to be at least substantially flush; and removing the carrier substrate from the surface.
申请公布号 WO2017023295(A1) 申请公布日期 2017.02.09
申请号 WO2015US43459 申请日期 2015.08.03
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 CHEN, Chien-Hua;CUMBIE, Michael W.;MOUREY, Devin Alexander
分类号 G02B6/13;G02B6/12;G02B6/42 主分类号 G02B6/13
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