Optical modules are disclosed. An example method includes coupling optoelectronic components to a carrier substrate; overmolding the optoelectronic components with a material to form a molded panel, a surface of the molded panel to be at least substantially flush; and removing the carrier substrate from the surface.
申请公布号
WO2017023295(A1)
申请公布日期
2017.02.09
申请号
WO2015US43459
申请日期
2015.08.03
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
CHEN, Chien-Hua;CUMBIE, Michael W.;MOUREY, Devin Alexander