| 发明名称 |
FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS |
| 摘要 |
A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5. |
| 申请公布号 |
US2017042043(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201615331747 |
申请日期 |
2016.10.21 |
| 申请人 |
NAGARAJAN SIVAKUMAR;RAZDAN SANDEEP;ANANTHAKRISHNAN NISHA;WEINMAN CRAIG J.;MIRPURI KABIRKUMAR J. |
发明人 |
NAGARAJAN SIVAKUMAR;RAZDAN SANDEEP;ANANTHAKRISHNAN NISHA;WEINMAN CRAIG J.;MIRPURI KABIRKUMAR J. |
| 分类号 |
H05K3/46;H01L21/56;C08G59/38;C08K9/06;C08G59/24;C08G59/42;H01L23/00;H01L23/29 |
主分类号 |
H05K3/46 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A method comprising:
forming a fluxing-encapsulant material comprising:
one or more epoxy resins having multiple functional groups and an epoxy equivalent weight (EEW) of 150-1,000;a curing agent having a functional group selected from the group consisting of anhydride, acid and amine; anda fluxing agent having a mono-carboxylic acid or di-carboxylic acid, and a pKa of 4-5. |
| 地址 |
CHANDLER AZ US |
