SEMICONDUCTOR DEVICE

摘要

A semiconductor device includes a semiconductor chip, a terminal layer, an insulation layer with an opening, a protection layer with an opening, an inner conductive member, an outer conductive member, and a conductive bonding member. The insulation layer includes a first insulation layer, and a second insulation layer opposite to the functional surface of the chip with respect to the first insulation layer. The second insulation layer includes a shield portion overlapping with the terminal layer in plan view, and a retracted portion not overlapping with the terminal layer in plan view. A back surface of the retracted portion of the second insulation layer is more distant from the functional surface in a z-direction than is the main surface of the terminal layer that is opposite to the functional surface.

主权项

1. A semiconductor device comprising:
a semiconductor chip including a functional surface on which an integrated circuit is formed; a terminal layer formed on the functional surface; an insulation layer covering a part of the terminal layer and formed with an insulation layer opening exposing another part of the terminal layer; a protection layer covering the insulation layer and formed with a protection layer opening exposing a part of the terminal layer; an inner conductive member that is held in contact with a terminal layer main surface of the terminal layer, that extends through the insulation layer opening and the protection layer opening, and that is exposed from the protection layer; an outer conductive member disposed at a position facing the functional surface; and a conductive bonding member that connects the inner conductive member and the outer conductive member, wherein the insulation layer includes a first insulation layer and a second insulation layer located opposite to the functional surface with respect to the first insulation layer, the second insulation layer includes a second insulation layer shield portion and a second insulation layer retracted portion, the second insulation layer shield portion overlapping with the terminal layer in plan view, the second insulation layer retracted portion not overlapping with the terminal layer in plan view, and the second insulation layer retracted portion has a second insulation layer front surface and a second insulation layer back surface closer to the functional surface than is the second insulation layer front surface, the second insulation layer back surface being more distant from the functional surface than is the terminal layer main surface in a direction in which the functional surface faces.