发明名称 |
SOLID STATE OPTOELECTRONIC DEVICE WITH PLATED SUPPORT SUBSTRATE |
摘要 |
A vertical solid state lighting (SSL) device is disclosed. In one embodiment, the SSL device includes a light emitting structure formed on a growth substrate. Individual SSL devices can include a embedded contact formed on the light emitting structure and a metal substrate plated at a side at least proximate to the embedded contact. The plated substrate has a sufficient thickness to support the light emitting structure without bowing. |
申请公布号 |
US2017040563(A1) |
申请公布日期 |
2017.02.09 |
申请号 |
US201615298131 |
申请日期 |
2016.10.19 |
申请人 |
Micron Technology, Inc. |
发明人 |
Odnoblyudov Vladimir;Schellhammer Scott D. |
分类号 |
H01L51/52;H01L33/06;H01L25/075;H01L33/00;H01L33/62;H01L33/46 |
主分类号 |
H01L51/52 |
代理机构 |
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代理人 |
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主权项 |
1. A wafer having a plurality of individual solid state lighting devices, comprising:
a light emitting structure having a first side and a second side opposite the first side, the light emitting structure comprising a first semiconductor material on the first side, a second semiconductor material on the second side, and an active region between the first and second semiconductor materials; an embedded contact at the second side; a plated substrate formed on the embedded contact, wherein the plated substrate has a thickness sufficient to inhibit bowing of the light emitting structure; and a plurality of exterior contacts formed on the first side of the light emitting structure, wherein the wafer is at least approximately 150 millimeters in diameter. |
地址 |
Boise ID US |