发明名称 |
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF ALPHA AMINO ACIDS AND BISEPOXIDES |
摘要 |
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of α-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features. |
申请公布号 |
US2017037527(A1) |
申请公布日期 |
2017.02.09 |
申请号 |
US201615220472 |
申请日期 |
2016.07.27 |
申请人 |
Rohm and Haas Electronic Materials LLC ;Dow Global Technologies LLC |
发明人 |
Thorseth Matthew;Niazimbetova Zuhra;Qin Yi;Woertink Julia;Dziewiszek Joanna;Reddington Erik;Lefebvre Mark |
分类号 |
C25D3/38;C25D7/12;H01L23/00;H05K3/40;H05K1/11;C25D5/02;H05K3/06 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
a) providing a substrate comprising a layer of photoresist, wherein the layer of photoresist comprises a plurality of apertures; b) providing a copper electroplating bath comprising one or more reaction products of one or more α-amino acids and one or more bisepoxides; an electrolyte; one or more accelerators; and one or more suppressors; c) immersing the substrate comprising the layer of photoresist with the plurality of apertures in the copper electroplating bath; and d) electroplating a plurality of copper photoresist defined features in the plurality of apertures, the plurality of photoresist defined features comprise an average % TIR of -5% to -1%. |
地址 |
Marlborough MA US |