发明名称 INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 A method includes providing a plurality of active regions on a substrate, and at least a first device isolation layer between two of the plurality of active regions, wherein the plurality of active regions extend in a first direction; providing a gate layer extending in a second direction, the gate layer forming a plurality of gate lines including a first gate line and a second gate line extending in a straight line with respect to each other and having a space therebetween, each of the first gate line and second gate line crossing at least one of the active regions, providing an insulation layer covering the first device isolation layer and covering the active region around each of the first and second gate lines; and providing an inter-gate insulation region in the space between the first gate line and the second gate line.
申请公布号 US2017040328(A1) 申请公布日期 2017.02.09
申请号 US201615333491 申请日期 2016.10.25
申请人 Samsung Electronics Co., Ltd. 发明人 PARK Hong-bae;KU Ja-hum;KIM Myeong-cheol;LEE Jin-wook;HAN Sung-kee
分类号 H01L27/11;H01L27/02;H01L29/06;H01L21/8238;H01L29/66;H01L21/02;H01L23/528;H01L27/092 主分类号 H01L27/11
代理机构 代理人
主权项
地址 Suwon-si KR