| 主权项 |
1. A semiconductor device comprising:
a support; a semiconductor chip die-bonding mounted face up on the support; a plurality of external connection portions electrically connecting the semiconductor chip to an outside; an intermediate substrate disposed on a side of the semiconductor chip opposite from the support and connecting the semiconductor chip to the plurality of external connection portions; and a plurality of connection bumps connecting the semiconductor chip and the intermediate substrate, wherein: the semiconductor chip includes a plurality of electrode pads connected to the intermediate substrate through the plurality of connection bumps; the plurality of connection bumps include a plurality of power supply bumps for supplying power to the semiconductor chip; and the intermediate substrate includes
a plurality of power supply pads connected to the plurality of electrode pads through the plurality of power supply bumps,a bump surface facing the semiconductor chip and having the plurality of power supply pads formed thereon,an external connection surface disposed on the opposite side from the bump surface and having a plurality of external connection pads formed thereon connected to the external connection portions, anda capacitor connected to the plurality of power supply bumps. |
