| 发明名称 |
POWER AMPLIFIER MODULE PACKAGE AND PACKAGING METHOD THEREOF |
| 摘要 |
Disclosed is a method of packaging a power amplifier module. The method of packaging a power amplifier module includes providing a unified pattern including a ceramic layer and a pattern formed on the ceramic layer, bonding the unified pattern on a metal layer, and depositing a ceramic sidewall, on which at least one external signal connection lead line is formed, on the unified pattern bonded the metal layer. |
| 申请公布号 |
US2017040182(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201514854098 |
申请日期 |
2015.09.15 |
| 申请人 |
CENTER FOR INTEGRATED SMART SENSORS FOUNDATION |
发明人 |
Lee Kyung Hak;HAN Min Seok;KIM Young Ki |
| 分类号 |
H01L21/48;H01L23/057;H03F3/21;H05K1/11;H05K3/10;H01L23/08;H05K1/03 |
主分类号 |
H01L21/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of packaging a power amplifier module, comprising:
providing a unified pattern comprising a ceramic layer and a pattern formed on the ceramic layer; bonding the unified pattern on a metal layer; and depositing a ceramic sidewall, on which at least one external signal connection lead line is formed, on the unified pattern bonded the metal layer. |
| 地址 |
Daejeon KR |
