| 发明名称 |
HEAT-CURABLE EPOXY RESIN COMPOSITION |
| 摘要 |
The invention provides a curable epoxy resin composition having a superior workability and capable of forming a cured product with a thermal expansion resistance, a heat resistance, an adhesiveness and a low water absorbability. The composition is a heat-curable resin composition comprising:
(A) an epoxy resin;(B) a carboxyl group-free curing agent; and(C) an annular carbodiimide compound, in whichan equivalent ratio of the carboxyl group-free curing agent (B) to the epoxy resin (A) is 0.5 to 1.5, and the annular carbodiimide compound (C) is in an amount of 2 to 50 parts by mass with respect to a total of 100 parts by mass of the epoxy resin (A) and the carboxyl group-free curing agent (B). |
| 申请公布号 |
US2017037238(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201615227104 |
申请日期 |
2016.08.03 |
| 申请人 |
Shin-Etsu Chemical Co., Ltd. |
发明人 |
KUSHIHARA Naoyuki;SUMITA Kazuaki |
| 分类号 |
C08L63/04;C08G59/62;C08K5/09;C08L61/06;C08G59/42;C08G59/50;C08K5/18;C08K5/3445;C08L63/00;C08K5/29 |
主分类号 |
C08L63/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat-curable epoxy resin composition comprising:
(A) an epoxy resin; (B) a carboxyl group-free curing agent; and (C) an annular carbodiimide compound, whereinan equivalent ratio of said carboxyl group-free curing agent (B) to said epoxy resin (A) is 0.5 to 1.5, and said annular carbodiimide compound (C) is in an amount of 2 to 50 parts by mass with respect to a total of 100 parts by mass of said epoxy resin (A) and said carboxyl group-free curing agent (B). |
| 地址 |
Tokyo JP |
