| 发明名称 |
Contact Smart Card and Method of Forming Such |
| 摘要 |
Contact smart card has a smart card contact pad and an IC chip. The smart card contact pad has a circuit substrate with a plurality of via holes there through, a card-reader contact element on a first side of the circuit substrate, and a plurality of chip connection elements on a second side of the circuit substrate. Each chip connection element is associated with a via hole through the circuit substrate. The card-reader contact element has an electrically conductive surface. The plurality of chip connection elements define a chip engagement region on the second side of the circuit substrate. The IC chip is mounted on the chip engagement region and electrically connected to the card-reader contact element through the via holes. |
| 申请公布号 |
US2017039462(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201615209171 |
申请日期 |
2016.07.13 |
| 申请人 |
Johnson Electric S.A. |
发明人 |
Demaso Arthur |
| 分类号 |
G06K19/02;G06K19/077;G06K19/04 |
主分类号 |
G06K19/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A contact smart card comprising:
a smart card contact pad; and an IC chip; wherein the smart card contact pad comprises: a circuit substrate including a plurality of via holes there through; a card-reader contact element on a first side of the circuit substrate; and a plurality of chip connection elements on a second side of the circuit substrate which is opposite the first side, each chip connection element being associated with a via hole through the circuit substrate; the card-reader contact element having an electrically conductive surface; the plurality of chip connection elements defining a chip engagement region on the second side of the circuit substrate; and the IC chip being mounted on the chip engagement region and electrically connected to the card-reader contact element through the via holes. |
| 地址 |
Murten CH |
