| 发明名称 |
LED MODULE |
| 摘要 |
A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers. |
| 申请公布号 |
US2017040497(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201615223713 |
申请日期 |
2016.07.29 |
| 申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
TAGAMI Naoki;ABE Masumi;FUJITANI Hisaki;TAKEHARA Kosuke;KURACHI Toshiaki |
| 分类号 |
H01L33/48;H01L33/32;H01L33/50;H01L33/62;H01L33/54 |
主分类号 |
H01L33/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode (LED) module comprising:
a substrate: a resist including a plurality ox layers, above the substrate; and an LED element mounted above the resist via an adhesive, wherein the adhesive includes an addition reaction type silicone resin, and in the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers. |
| 地址 |
Osaka JP |
