| 发明名称 |
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES |
| 摘要 |
A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location. |
| 申请公布号 |
US2017040280(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201615298406 |
申请日期 |
2016.10.20 |
| 申请人 |
Kulicke and Soffa Industries, Inc. |
发明人 |
Colosimo, JR. Thomas J.;Brunner Jon W. |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming a wire interconnect structure, the method comprising the steps of:
(a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the continuous length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the continuous length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location. |
| 地址 |
Fort Washington PA US |
