PRINTED WIRING BOARD PRODUCTION METHOD, SURFACE-TREATED COPPER FOIL, LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

摘要

Provided are a printed wiring board production method and a surface-treated copper foil allowing for the removal of copper foil at a good cost without losing the profile of the copper foil surface transferred onto the surface of a resin substrate, in a step for removing the copper foil from the resin substrate by providing a release layer to the copper foil and making the physical peeling of the resin substrate possible when the copper foil has been bonded to the resin substrate. The printed wiring board production method comprises: a step for bonding the resin substrate to the surface-treated copper foil provided with the release layer on the surface thereof, such bonding performed from the release layer side; a step for removing the surface-treated copper foil from the resin substrate to obtain the resin substrate to which the surface profile of the copper foil has been transferred to a peeling surface of the resin substrate; and a step for forming a plating pattern on the peeling surface side of the resin substrate to which the surface profile has been transferred.