| 摘要 |
A wiring substrate includes: a wiring substrate body including a first surface and a second surface; a first electrode pad including a first recess therein and formed on the first surface of the wiring substrate body; a second electrode pad including a second recess therein and formed on the first surface of the wiring substrate body; a first solder resist layer on the first surface of the wiring substrate body to cover the first and second electrode pads, the first solder resist layer including a first opening and a second opening whose opening area is larger than that of the first opening; and a first metal layer electrically connected to the first electrode pad and made of a material whose ionization tendency is smaller than that of a material of the first electrode pad. A depth of the first recess is larger than that of the second recess. |
