发明名称 振動素子、振動子、電子デバイス、および電子機器
摘要 PROBLEM TO BE SOLVED: To provide a small sized vibration element that achieves optimization of relation between a length and a thickness of a vibration portion of the vibration element and prevents occurrence of unnecessary spurious interference having influence on main vibration in the vibration element having a high-frequency, especially a resonant frequency not less than 200 MHz.SOLUTION: A vibration element 1 includes a vibration portion 12 subjected to thickness shear vibration. A relation between a dimension Lx of the vibration portion 12 in a vibration direction of the thickness shear vibration and a thickness H of the vibration portion 12 satisfies an expression of 50≤(Lx/H)≤70. A relation between a dimension Lz of the vibration portion 12 in a direction perpendicular to the vibration direction of the thickness shear vibration and the thickness H of the vibration portion 12 satisfies an expression of 35≤(Lz/H)≤55.
申请公布号 JP6074903(B2) 申请公布日期 2017.02.08
申请号 JP20120074284 申请日期 2012.03.28
申请人 セイコーエプソン株式会社 发明人 石井 修
分类号 H03H9/19 主分类号 H03H9/19
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