| 摘要 |
[Problem] The problem addressed by the present invention is to obtain a mold release film having superior mold release characteristics (peeling characteristics) from an adhesive agent such as an acrylic resin-based adhesive agent, an epoxy resin-based adhesive agent, or the like, has no stickiness of a mold release layer, and has non-staining properties. [Solution] The present invention pertains to: a mold release film characterized by resulting from laminating, to one surface of a substrate layer, a mold release layer obtained from an ethylene/α-olefin random copolymer (A) having a density of 850-880 kg/m3 and a melting point (Tm) of no greater than 63°C, the peel strength of the mold release layer with respect to an acrylic resin-based adhesive agent being 0.1-1 N/50 mm; and a method for producing the mold release film. |
