| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film adhesive sheet which is suitable for the production of a thinned electronic apparatus and has low temperature curability.SOLUTION: There is provided a thin film adhesive sheet which comprises, as essential components: an epoxy resin (A); a dicyandiamide (B) as a curing agent; an urea derivative (C) having a structure represented by the following general formula (1) as a curing accelerator: (wherein, Rrepresents an aromatic hydrocarbon group having 6 to 24 carbon atoms or an alicyclic hydrocarbon group having 5 to 24 carbon atoms; Rand Reach independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms or a divalent aliphatic hydrocarbon group having 4 or 5 carbon atoms formed by mutual bonding of Rand R; n is an integer of 1 to 3.) and is formed to have a thickness of 30 μm or less. |
