| 摘要 |
PROBLEM TO BE SOLVED: To provide a housing structure and an electronic apparatus using the housing structure, capable of realizing a light weight and a high intensity in a low cost.SOLUTION: A housing structure 10 has a structure that a frame member 30 formed by a fiber enhancement resin rods 32a to 32d to which an enhancement fiber 34 is arranged along with one longitudinal direction is adhered and fixed to a plate-like base material 28 formed by a fiber enhancement resin. The housing structure 10 is used as a back surface cover 12a of a housing 12 for an electronic equipment that forms a lid 14 of an electronic equipment 16 as, for example, a notebook PC, can be manufactured in a low cost, and is made lighter in weight and higher in intensity than the case of forming the frame member 30 by a general resin being not the fiber enhancement resin or a metal.SELECTED DRAWING: Figure 2 |
