发明名称 半導体製造装置用部材及びその製法
摘要 A high-frequency power supply includes a shaft bonded to one surface of a plate serving as a gas distributor plate. The plate includes a radio-frequency electrode buried therein. The shaft has a through-hole through which a gas flows. The plate and the shaft are made of a ceramic material. The shaft has a double-tube structure including the inner tube and the outer tube . The interior space of the inner tube forms the through-hole. The plate is hermetically solid-state bonded to the inner tube and the outer tube. The shaft is bonded to the center of the plate.
申请公布号 JP6078450(B2) 申请公布日期 2017.02.08
申请号 JP20130215951 申请日期 2013.10.17
申请人 日本碍子株式会社 发明人 海野 豊;阿部 哲久
分类号 H01L21/3065 主分类号 H01L21/3065
代理机构 代理人
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